Method for manufacturing fabric type circuit board
AssigneeElectronics and Telecommunications Research Institute
InventorsBae sun Kim, Yong Ki Son, Ji Eun Kim, Sung yong Shin
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Abstract
Methods for manufacturing a fabric-type circuit board, including: forming a metal plating layer on a base substrate, forming a circuit pattern by etching the metal plating layer, bonding a carrier film on the circuit pattern, and bonding an adhesive film directly below the circuit pattern after removing the base substrate; or bonding an adhesive film to a metal thin film, forming a circuit pattern by etching the metal thin film, and bonding a carrier film on the circuit pattern. In either case, the circuit pattern is transferred to a fabric by bonding the adhesive film to the fabric.
Claims19
A method for manufacturing a fabric type circuit board, comprising:
- forming a metal plating layer on a base substrate;
- forming a circuit pattern by etching the metal plating layer;
- bonding a carrier film on the circuit pattern;
- bonding an adhesive film directly below the circuit pattern after removing the base substrate;
- and
- transferring the circuit pattern by bonding the adhesive film to a fabric, thereby manufacturing the fabric type circuit board.
A method for manufacturing a fabric type circuit board, comprising:
- bonding an adhesive film to a metal thin film;
- forming a circuit pattern by etching the metal thin film;
- bonding a carrier film on the circuit pattern;
- and
- transferring the circuit pattern by bonding the adhesive film to a fabric, thereby manufacturing the fabric type circuit board.
Dependencies are inferred from the claim text.