Manufacture of a circuit board containing a component

A method for manufacturing a circuit board from an intermediate product having an insulator layer and at least one component at least substantially inside the insulator layer, the at least one component having contact elements that are revealed substantially on the level of the surface of the insulator layer, the at least one component further comprising semiconductor material in electrical contact with the contact elements, the method comprising:

• taking the intermediate product, in which the contact elements are revealed,
• individually cleaning the surfaces of the contact elements by means of a laser for the creation of electrical contacts,
• manufacturing a conductor-pattern layer on the surface of the insulator by growing the conductor-pattern layer directly in a correct shape by a growing method, in such a way that the conducting material of the conductor-pattern layer connects electrically to the contact elements of the component and the conductor-pattern layer has the correct shape,
• simultaneously, with the manufacturing of the conductor-pattern layer, manufacturing a second conductor-pattern layer on the opposite side of the insulator layer, and
• continuing manufacturing of the circuit board by making a number of alternating insulator layers and conductor-pattern layers on top of the conductor-pattern layers.

A method for manufacturing a circuit board, the circuit board containing at least one conductor-pattern layer and at least one component electrically connected thereto, which is located at least substantially inside the insulator layer of the circuit board, the at least one component comprising semiconductor material and contact elements in electrical contact with the semiconductor material, the method comprising:

• taking a support,
• attaching the at least one component to the support,
• manufacturing the insulator layer on the surface of the support, around each attached component,
• removing the support and revealing the contact elements of the component,
• individually cleaning the surfaces of the contact elements by means of a laser for the creation of electrical contacts,
• manufacturing a conductor-pattern layer on the surface of the insulator by growing the conductor-pattern layer directly in a correct shape by a growing method, in such a way that the conductor material of the conductor-pattern layer connects electrically to the contact elements of the component and the conductor-pattern layer has the correct shape,
• simultaneously, with the manufacturing of the conductor-pattern layer, manufacturing a second conductor-pattern layer on the opposite side of the insulator layer, and
• continuing manufacturing of the circuit board by making a number of alternating insulator layers and conductor-pattern layers on top of the conductor-pattern layers.