Temporary fixing composition
AssigneeThree Bond Fine Chemical Co., Ltd.
InventorsYasutoshi Nogami, Manabu Kirino, Yoshimune Shundoh, Shinya Kodaira
Life of this patent
Estimating the term…
Abstract
In the past, it was difficult to fix an adherend sufficiently during polishing processing and to peel off the adherend conveniently. Provided is a non-reactive temporary fixing composition for plane polishing having a shear stress strength of not less than 0.05 MPa and a normal stress strength of less than 100 N.
Claims6
A non-reactive temporary fixing composition for plane polishing having a shear stress strength of not less than 0.05 MPa and a normal stress strength of less than 100 N per adhesion area of 15 mm×50 mm, comprising:
- (A) a thermoplastic resin consisting of α-olefin monomer units having 16-35 carbon atoms;
- and
- (B) a hydrocarbon component selected from the group consisting of thermoplastic resins other than the component (A), thermoplastic elastomers and rubber elastomers, wherein said hydrocarbon component is solid at 25° C.;
- and/or
- (C) a hydrocarbon compound that is liquid at 25° C. and has a viscosity of 1 to 1,000 mPa·s at 25° C.;
- wherein component (B) is present in 0 to 30 parts by mass with respect to 100 parts by mass of component (A), and/or component (C) is present in 0 to 80 parts by mass with respect to 100 parts by mass of component (A).
A non-reactive temporary fixing composition for plane polishing having a shear stress strength of not less than 0.05 MPa and a normal stress strength of less than 100 N per adhesion area of 15 mm×50 mm, comprising:
- (A) a thermoplastic resin consisting of poly-α-C16-C35-olefin;
- and
- (B) a hydrocarbon component selected from the group consisting of thermoplastic resins other than the component (A), thermoplastic elastomers and rubber elastomers, wherein said hydrocarbon component is solid at 25° C.;
- and/or
- (C) a hydrocarbon compound that is liquid at 25° C. and has a viscosity of 1 to 1,000 mPa·s at 25° C.;
- wherein component (B) is present in 0.1 to 30 parts by mass with respect to 100 parts by mass of component (A), and/or component (C) is present in 1 to 80 parts by mass with respect to 100 parts by mass of component (A).
Dependencies are inferred from the claim text.