Deposit protection cover and plasma processing apparatus

A plasma processing apparatus including a processing chamber and processing a substrate by generating plasma therein, the apparatus comprising:

• a deposit protection cover made of an aluminum plate having a surface on which an anodic oxidation process is performed, the cover being detachably provided within the processing chamber so as to cover a preset portion of the processing chamber,
• wherein the deposit protection cover comprises an electrode detachment surface comprising an aluminum base surface that is exposed, wherein the aluminum base surface of the deposit protection cover is exposed only at the electrode detachment surface,
• wherein the aluminum plate has a plate portion and a protrusion portion which is extended downward from the plate portion in a vertical direction,
• the anodic oxidation process is performed by using an electrode part protruded from a bottom of the protrusion portion at the electrode detachment surface, and then subsequently removed after the anodic oxidation process is performed, and
• the electrode detachment surface is positioned at a region that is not directly exposed to the plasma within the processing chamber,
• wherein the preset portion is a non-exhaust-path portion of a bottom surface of the processing chamber that does not provide an exhaust path below a baffle plate for gas exhaust, the baffle plate being configured to surround a mounting table that mounts thereon the substrate within the processing chamber, and
• an exhaust-path portion of the bottom surface of the processing chamber that provides the exhaust path and the non-exhaust-path portion form a ring-shaped surface of the processing chamber around the mounting table.