Polishing pad with alignment feature

A polishing pad for polishing a substrate, the polishing pad comprising:

• a polishing body having a polishing surface and a back surface, the polishing surface having a pattern of grooves comprising a polishing region, wherein the polishing region of the pattern of grooves comprises an alignment feature creating a singular asymmetry within the pattern of grooves, wherein the pattern of grooves comprises a plurality of circumferential grooves intersecting with a plurality of radial grooves, and wherein the alignment feature comprises an interruption in one of the circumferential grooves, the interruption disposed between two radial grooves.