Semiconductor device with surface electrodes
AssigneeDenso Corporation
InventorsDaisuke Fukuoka, Takanori Teshima, Kuniaki Mamitsu
Life of this patent
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Abstract
A semiconductor device includes a plate-shaped semiconductor element and an electrically insulating resin member. The semiconductor element has a front-surface electrode on its front surface and a back-surface electrode on its back surface. The resin member encapsulates the semiconductor element. The front-surface electrode is exposed to a front side of an outer surface of the resin member. The back-surface electrode is exposed to a back side of the outer surface of the resin member. The resin member has an extension portion that covers the entire side surface of the semiconductor element and extends from the side surface of the semiconductor element in a direction parallel to the front surface of the semiconductor element.
Claims13
A semiconductor device comprising:
- a plate-shaped semiconductor element having a front surface, a back surface opposite to the front surface, and a side surface between the front surface and the back surface, the semiconductor element including a front-surface electrode on the front surface and a back-surface electrode on the back surface;
- and
- an electrically insulating resin member that encapsulates and seals the semiconductor element, wherein
- the front-surface electrode has an exposed surface exposed to a front side of an outer surface of the resin member,
- the back-surface electrode has an exposed surface exposed to a back side of the outer surface of the resin member,
- the resin member has a first extension portion that covers the entire side surface of the semiconductor element and extends from the side surface of the semiconductor element in a direction parallel to the front surface of the semiconductor element, and
- the resin member and the first extension portion are a single piece of resin.
Dependencies are inferred from the claim text.