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US 8,963,301 B1Granted
Integrated circuit package and method of making the same
AssigneeAmkor Technology, Inc.
InventorThomas P. Glenn
Life of this patent
Estimating the term…
Abstract
Packages for an integrated circuit die and methods and lead frames for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wares, and an encapsulant. The die pad and contacts are located at a lower surface of the package. The die pad and the contacts have side surfaces which include reentrant portions and asperities to engage the encapsulant.
Claims23
A semiconductor device comprising:
- a metal die pad comprising a top planar surface, a bottom planar surface opposite the top planar surface, and at least four sides between the top and bottom planar surfaces;
- a semiconductor die coupled to the top planar surface of the metal die pad;
- a plurality of metal members, each comprising:
- a top surface;
- a bottom surface;
- a curved side surface;
- and
- a straight side surface opposite the curved side surface;
- and
- an encapsulating material covering at least:
- said semiconductor die;
- the top planar surface and the at least four sides of said metal die pad;
- and
- the top surface and the curved side surface of each of said plurality of metal members.
11 more elements
A semiconductor device comprising:
- a metal die pad comprising a top planar surface, a bottom planar surface opposite the top planar surface, and at least four sides between the top and bottom planar surfaces;
- a semiconductor die coupled to the top planar surface of the metal die pad;
- a plurality of metal members, each comprising:
- a top surface;
- a bottom surface;
- a curved side surface;
- and
- a straight side surface;
- and
- an encapsulating material covering at least:
- said semiconductor die;
- the top planar surface and the at least four sides of said metal die pad;
- and
- the top surface and the curved side surface of each of said plurality of metal members,
- wherein the straight side surface of each of said plurality of metal members is exposed by the encapsulating material.
12 more elements
A semiconductor device comprising:
- a metal die pad comprising a top planar surface, a bottom planar surface opposite the top planar surface, and at least four sides between the top and bottom planar surfaces;
- a semiconductor die coupled to the top planar surface of the metal die pad;
- a plurality of metal members, each comprising:
- a top surface;
- a bottom surface;
- a first side surface that is curved;
- a second side surface that is straight;
- a third side surface extending between a first end of the second side surface and the first side surface;
- and
- a fourth side surface extending between a second end of the second side surface and the first side surface;
- and
- an encapsulating material covering at least:
- said semiconductor die;
- the top planar surface and the at least four sides of said metal die pad;
- and
- the top surface, the first side surface, the third side surface, and the fourth side surface of each of said plurality of metal members,
- wherein the second side surface of each of said plurality of metal members is exposed by the encapsulating material.
14 more elements
Dependencies are inferred from the claim text.