Loading patent…
AssigneeNorthwestern University
InventorsChad A. Mirkin, Wooyoung Shim, Adam B. Braunschweig, Xing Liao, Jinan Chai, Jong Kuk Lim, Gengfeng Zheng, Zijian Zheng
Estimating the term…
Disclosed are methods of lithography using a tip array having a plurality of pens attached to a backing layer, where the tips can comprise a metal, metalloid, and/or semi-conducting material, and the backing layer can comprise an elastomeric polymer. The tip array can be used to perform a lithography process in which the tips are coated with an ink (e.g., a patterning composition) that is deposited onto a substrate upon contact of the tip with the substrate surface. The tips can be easily leveled onto a substrate and the leveling can be monitored optically by a change in light reflection of the backing layer and/or near the vicinity of the tips upon contact of the tip to the substrate surface.
A tip array comprising a plurality of tips fixed to an elastomeric backing layer, the tips comprising a metal, a metalloid, a semi-conducting material, or a combination thereof, and each tip having a radius of curvature of less than 100 nm.
A tip array comprising a plurality of tips fixed to an elastomeric backing layer, the tips comprising a metal, a metalloid, a semi-conducting material, or a combination thereof, each tip having a radius of curvature of less than 1 μm, the tips comprising silicon, silicon nitride, gallium, gallium nitride, gallium sulfide, gallium arsenide, or a mixture thereof.
A tip array comprising a plurality of tips fixed to an elastomeric backing layer, the tips comprising a metal, a metalloid, a semi-conducting material, or a combination thereof, each tip having a radius of curvature of less than 1 μm, and the tips and backing layer have a combined thickness of less than 1 mm.
A tip array comprising a plurality of tips fixed to an elastomeric backing layer, the tips comprising a metal, a metalloid, a semi-conducting material, or a combination thereof, and a coating on the exposed surfaces of the tips and the surface of the backing layer adjacent to the tips, each tip having a radius of curvature of less than 1 μm.
Dependencies are inferred from the claim text.