Reliability evaluation and system fail warning methods using on chip parametric monitors
AssigneeMentor Graphics Corporation
InventorsJeanne P. Bickford, John R. Goss, Nazmul Habib, Robert McMahon
Life of this patent
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Abstract
A method of reliability evaluation and system fail warning using on chip parametric monitors. The method includes determining impact of parametric variation on reliability by identifying key parametric questions to be answered by stress, identifying parametric macros for each parameter, and identifying layout sensitive areas of evaluation. The process can also include a set of parametric macros in one of a test site or a product to be stressed, testing the set of parametric macros prior to start of stress and at each stress read out, and setting life time parameter profile for technology.
Claims17
One or more computer-readable storage having instruction thereon for executing a method for monitoring a semiconductor product, comprising:
- inserting at least one parametric macro onto the semiconductor product so that the parametric macro is stored within the semiconductor product, the parametric macro measuring at least a voltage level in the semiconductor product;
- monitoring the at least one parametric macro to determine whether the voltage level is within a threshold amount of a level that can cause the semiconductor product to fail;
- and
- issuing a warning that the semiconductor product is in danger of failing during use in response to the monitoring that the voltage level is within the threshold amount of the level that can cause the semiconductor product to fail.
One or more computer-readable storage having instruction thereon for executing a method for monitoring a semiconductor product, comprising:
- inserting at least one parametric macro onto the semiconductor product so that the parametric macro is stored within circuit logic in the semiconductor product, the parametric macro measuring at least one parameter on the semiconductor product that is related to failure over time of use of the semiconductor product;
- monitoring the at least one parametric macro to determine whether the at least one parameter is within a threshold of a level that can cause the semiconductor product to fail;
- and
- in response to the monitoring, issuing a warning that the semiconductor product is in danger of failing.
Dependencies are inferred from the claim text.