Via density and placement in radio frequency shielding applications
AssigneeSkyworks Solutions, Inc.
InventorsHoward E. Chen, Matthew Sean Read, Hoang Mong Nguyen, Anthony James LoBianco, Guohao Zhang, Dinhphuoc Vu Hoang
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Abstract
Aspects of the present disclosure relate to determining the location and/or density of vias that form part of an RF isolation structure of a packaged module and the resulting RF isolation structures. From electromagnetic interference (EMI) data, locations of where via density can be increased and/or decreased without significantly degrading the EMI performance of the RF isolation structure can be identified. In certain embodiments, one or more vias can be added and/or removed from a selected area of the packaged module based on the EMI data.
Claims29
A packaged module comprising:
- a substrate configured to receive at least one component;
- a radio frequency (RF) component coupled to a major surface of the substrate;
- a ground contact disposed below the RF component, the ground contact configured to receive a ground potential from external to the packaged module;
- a plurality of vias in the substrate, the plurality of vias disposed around the RF component, the plurality of vias having a higher density in a first region of the packaged module than a second region of the packaged module so as to provide a stronger ground connection to the first region than to the second region, the first region being associated with a higher electromagnetic interference than the second region;
- a racetrack including a conductive trace along a periphery of the substrate and in a different layer of the substrate than the plurality of vias, the racetrack being electrically coupled to the plurality of vias below the RF component;
- and
- a conductive layer disposed above the RF component, the conductive layer electrically coupled to the ground contact by way of an electrical path that includes the plurality of vias such that the plurality of vias and the conductive layer form at least a portion of an RF isolation structure around the RF component.
A packaged module comprising:
- a substrate configured to receive at least one component;
- a radio frequency (RF) component coupled to a major surface of the substrate;
- a ground contact disposed below the RF component, the ground contact configured to receive a ground potential for the packaged module;
- and
- a plurality of vias disposed around the RF component, the plurality of vias having a higher density in a first region around the RF component than a second region around the RF component having approximately the same area as the first region so as to provide a stronger ground connection to the first region than to the second region, the first region being more sensitive to external radiation than the second region;
- a racetrack including a conductive trace along a periphery of the substrate and in a different layer of the substrate than the plurality of vias, the racetrack being electrically coupled to the plurality of vias below the RF component;
- and
- a conductive layer disposed above the RF component, the conductive layer electrically coupled to the ground contact by way of an electrical path that includes the plurality of vias such that the plurality of vias and the conductive layer form at least a portion of an RF isolation structure around the RF component.
Dependencies are inferred from the claim text.