Package assembly and method of tuning a natural resonant frequency of a package
AssigneeFreescale Semiconductor, Inc.
InventorsRobert Bauer, Thorsten Hauck
Life of this patent
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Abstract
A package assembly comprises an electronic device; a package body; at least a first plurality of leads having a first geometrical shape and a second plurality of leads having a second geometrical shape, protruding from the package body; each of the first plurality of leads being located in corners of the package body; or the first and the second plurality of leads arranged in at least a first row and a second row located in parallel to the first row; each of the rows comprising at least two leads; the first row being transformable into the second row by mirroring the first row along a symmetry plane of the package body; each of the first plurality of leads having the first geometrical shape different from the second geometrical shape.
Claims13
A package assembly, comprising:
- an electronic device;
- a package body;
- at least a first plurality of leads having a first geometrical shape and a second plurality of leads having a second geometrical shape, protruding from said package body;
- said first and said second plurality of leads arranged in at least a first row and a second row located in parallel to said first row;
- each of said rows comprising at least two leads;
- said first row being transformable into said second row by mirroring said first row along a symmetry plane of said package body;
- each of said first plurality of leads having said first geometrical shape different from said second geometrical shape;
- and
- wherein a width of each of said first plurality of leads differs from a width of each of said second plurality of leads, wherein said width of each of said first plurality of leads is a sum of n times said width of one of said second plurality of leads plus (n−1) times a pitch between two neighboring leads of said second plurality of leads, n being an integer number.
A method of tuning a natural resonant frequency of a package, comprising:
- providing an electronic device;
- providing a package body;
- providing at least a first plurality of leads having a first geometrical shape and a second plurality of leads having a second geometrical shape, protruding from said package body;
- providing each of said first plurality of leads having said first geometrical shape different from said second geometrical shape;
- arranging said first and said second plurality of leads in at least a first row and a second row located in parallel to said first row;
- each of said rows comprising at least two leads;
- said first row being transformable into said second row by mirroring said first row along a symmetry plane of said package body;
- and
- wherein a width of each of said first plurality of leads differs from a width of each of said second plurality of leads, wherein said width of each of said first plurality of leads is a sum of n times said width of one of said second plurality of leads plus (n−1) times a pitch between two neighboring leads of said second plurality of leads, n being an integer number.
Dependencies are inferred from the claim text.