Low profile wire bonded USB device

A USB flash memory device, comprising:

• a substrate;
• a conductance pattern defined on a surface of the substrate;
• USB connector pins formed in the conductance pattern on the substrate for removable insertion into a host device and for electrically coupling the USB flash memory device with the host device when inserted into the host device;
• one or more semiconductor die, the one or more semiconductor die including die bond pads on a surface of the one or more semiconductor die;
• wire bonds formed between the die bond pads on the one or more semiconductor die and the substrate;
• molding compound encapsulating the one or more semiconductor die and wire bonds.

A USB flash memory device, comprising:

• a substrate;
• a conductance pattern defined on a surface of the substrate;
• USB connector pins formed in the conductance pattern on the substrate for removable insertion into a host device and for electrically coupling the USB flash memory device with the host device when inserted into the host device;
• a flash memory semiconductor die including die bond pads;
• wire bonds formed between the die bond pads on the flash memory semiconductor die and the substrate;
• molding compound encapsulating the flash memory die and wire bonds.

A USB flash memory device, comprising:

• a substrate;
• a conductance pattern defined on a surface of the substrate;
• USB connector pins formed in the conductance pattern on the substrate for removable insertion into a host device and for electrically coupling the USB flash memory device with the host device when inserted into the host device;
• a flash memory semiconductor die including a first set of die bond pads;
• a first set of wire bonds formed between the first set of die bond pads on the flash memory semiconductor die and the substrate;
• a controller semiconductor die including a second set of die bond pads;
• a second set of wire bonds formed between the second set of die bond pads on the controller semiconductor die and the substrate;
• molding compound encapsulating the flash memory and controller semiconductor die and first and second sets of wire bonds.

A USB flash memory device, comprising:

• a substrate including a conductive layer;
• contact pads defined in the conductive layer for electrically connecting to components mounted on the substrate;
• USB connector pins defined in the conductive layer for electrically coupling the USB flash memory device with host device when the USB flash memory device is inserted into the host device;
• one or more semiconductor die, the one or more semiconductor die including die bond pads on a surface of the one or more semiconductor die;
• wire bonds formed between the die bond pads on the one or more semiconductor die and the contact pads on the substrate;
• molding compound encapsulating the one or more semiconductor die and wire bonds.