US 8,947,873 B2 · Immersion-cooled and conduction-cooled electronic system

Abstract

A cooled electronic system and cooling method are provided, where an electronics board having a plurality of electronic components mounted to the board is cooled by an apparatus which includes an immersion-cooled electronic component section and a conduction-cooled electronic component section. The immersion-cooled section includes an enclosure at least partially surrounding and forming a compartment about multiple electronic components of the electronic components mounted to the electronics board, and a fluid disposed within the compartment. The multiple electronic components are, at least in part, immersed within the fluid to facilitate immersion-cooling of those components. The conduction-cooled electronic component section includes at least one electronic component of the electronic components mounted to the electronics board, and the at least one electronic component is indirectly liquid-cooled, at least in part, via conduction of heat from the at least one electronic component.

Claims24

Dependent claims

A cooled electronic system comprising:

an electronics board comprising a plurality of electronic components mounted to the electronics board;
and
a cooling apparatus facilitating cooling of the plurality of electronic components mounted to the electronics board, the cooling apparatus comprising:
an immersion-cooled electronic component section comprising:
an enclosure at least partially surrounding and forming a compartment about multiple electronic components of the plurality of electronic components mounted to the electronics board;
and
a fluid disposed within the compartment, the multiple electronic components being, at least partially, immersed within the fluid to facilitate immersion-cooling thereof;
and
a conduction-cooled electronic component section, the conduction-cooled electronic component section comprising at least one electronic component of the plurality of electronic components mounted to the electronics board, and the at least one electronic component being indirectly liquid-cooled, at least in part, via conduction of heat from the at least one electronic component.

6 more elements

A liquid-cooled electronics rack comprising:

an electronics rack comprising at least one electronic system, the at least one electronic system comprising an electronics board including a plurality of electronic components mounted to the electronics board;
and
a cooling apparatus comprising:
an immersion-cooled electronic component section, the immersion-cooled electronic component section comprising:
an enclosure at least partially surrounding and forming a compartment about multiple electronic components of the plurality of electronic components mounted to the electronics board;
and
a fluid disposed within the compartment, the multiple electronic components being, at least partially, immersed within the fluid to facilitate immersion-cooling thereof;
and
a conduction-cooled electronic component section, the conduction-cooled electronic component section comprising at least one electronic component of the plurality of electronic components mounted to the electronics board, and the at least one electronic component being indirectly liquid-cooled, at least in part, via conduction of heat from the at least one electronic component.

6 more elements

Dependencies are inferred from the claim text.

Immersion-cooled and conduction-cooled electronic system

Life of this patent

Immersion-cooled and conduction-cooled electronic system

Life of this patent

Abstract

Claims24