Multilayer ceramic electronic component and manufacturing method thereof

Abstract

There is provided a multilayer ceramic electronic component. The multilayer ceramic electronic component includes a ceramic main body including a dielectric layer, and first and second internal electrodes disposed to face each other within the ceramic main body and having the dielectric layer interposed therebetween. When an average roughness of center lines of the first and second internal electrodes is Ra, a maximum distance from a virtual line corresponding to Ra to a bottom of a pit (d) formed below the virtual line is 0.1 μm to 13 μm. The surface roughness of the internal electrode printed surface is improved to decrease the occurrence of electrical shorts.

Dependencies are inferred from the claim text.