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US 8,947,834 B2Granted
Method and apparatus for chemical-mechanical polishing
AssigneeSeagate Technology LLC
InventorsEric Walter Singleton, Shaun Eric McKinlay, Stacey Christine Wakeham
Life of this patent
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Abstract
In accordance with certain embodiments, a method can be utilized that includes depositing a backfill material layer over a reader stack; depositing a chemical-mechanical-polishing stop layer above the layer of backfill material; and depositing a sacrificial layer on top of the chemical-mechanical-polishing stop layer.
Claims20
A method comprising:
- depositing a backfill material layer over a reader stack;
- after depositing the backfill material, depositing a chemical-mechanical-polishing stop layer above the layer of backfill material;
- and
- after depositing the chemical-mechanical-polishing stop layer, depositing a sacrificial layer on top of the chemical-mechanical-polishing stop layer.
1 more element
An apparatus comprising:
- a reader stack;
- a backfill layer next to and above the reader stack;
- a chemical-mechanical polishing stop layer on top of the backfill layer;
- and
- a sacrificial layer on top of the chemical-mechanical-polishing stop layer.
2 more elements
Dependencies are inferred from the claim text.