Method of forming electrical connections from solder posts
AssigneeSeagate Technology LLC
InventorsAaron Michael Collins, Scott Matzke, Christopher Unger, Paul Davidson, Daniel Richard Buettner
Life of this patent
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Abstract
A method for forming an electrical interconnection between a slider pad and a suspension pad that is adjacent to and positioned at an angle relative to the slider pad, which includes the steps of forming a solder bump on a first surface of the slider pad, reshaping the solder bump into a protrusion having an ellipsoidal shape that extends from the slider pad and contacts the suspension pad, and applying a laser to the ellipsoidal protrusion to reflow the solder bump while simultaneously applying a downward pressure to the solder bump in order to form a solder fillet between the slider pad and the suspension pad.
Claims15
A method of forming an electrical interconnection between a slider pad and a suspension pad that is adjacent to and positioned at an angle relative to the slider pad, the method comprising the steps of:
- forming a solder bump on a first surface of the slider pad;
- reshaping the solder bump into a protrusion having an ellipsoidal shape that extends from the slider pad and contacts the suspension pad;
- and
- applying a laser to the ellipsoidal protrusion to reflow the solder bump while simultaneously applying a pressure to the solder bump in order to form a solder fillet between the slider pad and the suspension pad.
A method of making a solder bump on each of a plurality of slider pads for use in forming a plurality of electrical interconnections, each of which is between one slider pad and one suspension pad, the method comprising the steps of:
- forming a solder post on each of a plurality of slider pads, wherein the slider pads are positioned adjacent to each other relative to a plurality of sliders of a wafer;
- encasing the solder posts in a protective material;
- separating the plurality of slider pads from each other;
- and
- removing the protective material to expose the solder post of each of the slider pads.
The method of step 9, wherein the step of separating the plurality of slider pads from each other comprises:
- slicing the wafer into multiple rows, each of which corresponds to one of the rows of slider pads;
- and
- dicing each of the multiple rows into a plurality of sliders, each of which comprises one of the slider pads.
A method of forming an electrical interconnection between a slider pad and a suspension pad that is adjacent to and positioned at an angle relative to the slider pad, the method comprising the steps of:
- forming a solder bump on a first surface of the suspension pad;
- reshaping the solder bump into a protrusion having an ellipsoidal shape that extends from the suspension pad and contacts the slider pad;
- and
- applying a laser to the ellipsoidal protrusion to reflow the solder bump while simultaneously applying a pressure to the solder bump in order to form a solder fillet between the slider pad and the suspension pad.
Dependencies are inferred from the claim text.