US 8,947,776 B2Granted

Suction apparatus, semiconductor device observation device, and semiconductor device observation method

AssigneeHamamatsu Photonics K.K.

InventorsHirotoshi Terada, Hiroyuki Matsuura

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Abstract

A suction unit 10 includes a main body portion having a first surface 13 on which a semiconductor wafer W is arranged and a second surface 14 opposite to the first surface 13, and in which a through-hole 15 that penetrates through the first surface 13 and the second surface 14 is formed and a light transmitting portion having a light incident surface 16 and a light emitting surface 17, and which is fitted to the through-hole 15. Further, in the first surface 13, a first suction groove 13a for vacuum sucking the semiconductor wafer W to fix the semiconductor device D to the light incident surface 16 is formed, and in the second surface 14, a second suction groove 14a for vacuum sucking the solid immersion lens S to fix the solid immersion lens S to the light emitting surface 17 is formed.

Claims12

Dependent claims

A suction unit to be used for a semiconductor device observation apparatus for performing observation of a semiconductor device by use of a solid immersion lens, comprising:

a main body portion having a first surface on which a semiconductor wafer formed with the semiconductor device is arranged and a second surface that is a surface opposite to the first surface, and in which a through-hole that penetrates through the first surface and the second surface is formed;
and
a light transmitting portion having a light incident surface onto which light from the semiconductor device is made incident and a light emitting surface from which light made incident from the light incident surface is emitted, and which is fitted to the through-hole so that the light incident surface is exposed to a side of the first surface and the light emitting surface is exposed to a side of the second surface, wherein
in the first surface, a first suction groove for vacuum sucking the semiconductor wafer to fix the semiconductor device to the light incident surface is formed, and
in the second surface, a second suction groove for vacuum sucking the solid immersion lens to fix the solid immersion lens to the light emitting surface is formed.

2 more elements

A semiconductor device observation method for observing a semiconductor device formed in a semiconductor wafer, comprising:

a voltage application step of applying voltage to a predetermined site of the semiconductor device arranged on a light incident surface of a light transmitting portion of a suction unit;
a detection step of detecting a site to be observed in the semiconductor device by observing light emitted from the semiconductor device and to be transmitted through the light transmitting portion by use of a first objective lens arranged on a side of a light emitting surface opposite to the light incident surface of the light transmitting portion;
an alignment step of aligning a second objective lens having a magnification higher than that of the first objective lens and a solid immersion lens attached to the second objective lens, on the light emitting surface side, with the site to be observed detected in the detection step;
a suction fixing step of fixing the solid immersion lens to the light emitting surface by vacuum suction;
a focus adjusting step of adjusting a focus of the second objective lens by adjusting the position of the second objective lens in an optical axis direction of the second objective lens;
and
an image acquisition step of acquiring an image of the site to be observed by use of the second objective lens.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application: 13/701,035Filed 21 Jun 2011
Priority: JP P2010-14286823 Jun 2010
Published: US 2013/0088714 A111 Apr 2013
Granted: 3 Feb 2015
Term ends: Not estimatedThe source records don’t support an estimate.

Classification8 codes

G01N 21/9501
Characterised by the material or shape of the object to be examined: semiconductor wafers
G01N 21/01
Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light:…
H10P 72/7616
The wafers being placed on a susceptor, stage or support: characterised by a coating, a hardness or a material
H10P 72/7624
The wafers being placed on a susceptor, stage or support: characterised by the mechanical construction of the susceptor, stage or support