Solid-state imaging unit, method of manufacturing solid-state imaging unit, and electronic apparatus

A method of manufacturing a solid-state imaging unit, comprising:

• covering a sensor unit in which a solid-state imaging device is mounted on a substrate and a lead formed on the substrate and a pad formed on the solid-state imaging device are electrically connected to each other by a bonding wire, with a frame member which is formed into the form of a frame surrounding side portions of the solid-state imaging device and has a leg portion formed on the lower surface side so as to protrude toward an imaging surface of the solid-state imaging device, from above the sensor unit;
• integrally fixing the frame member and the solid-state imaging device to each other in a state where the leg portion comes into contact with an intermediate area which is located between an imaging area and a pad forming area on the imaging surface;
• and
• mounting an optical member having optical transparency on an upper surface side of the frame member so as to face the imaging surface of the solid-state imaging device,
• wherein the frame member has a second leg portion which is connected to the leg portion, passes a side of the solid-state imaging device, and terminates without contacting the substrate.

A method of manufacturing a solid-state imaging unit, comprising:

• covering a sensor unit in which a solid-state imaging device is mounted on a substrate and a lead formed on the substrate and a pad formed on the solid-state imaging device are electrically connected to each other by a bonding wire, with an optical unit which includes a frame member which is formed into the form of a frame surrounding side portions of the solid-state imaging device and has a leg portion formed on the lower surface side so as to protrude toward an imaging surface of the solid-state imaging device, and an optical member having optical transparency and mounted on the upper surface side of the frame member, from above the sensor unit;
• and
• integrally fixing the frame member and the solid-state imaging device to each other in a state where the optical member faces the imaging surface of the solid-state imaging device and the leg portion comes into contact with an intermediate area which is located between an imaging area and a pad forming area on the imaging surface,
• wherein the frame member has a second leg portion which is connected to the leg portion, passes a side of the solid-state imaging device, and terminates without contacting the substrate.

An electronic apparatus comprising:

• a solid-state imaging unit;
• and
• a signal processing circuit which processes an output signal of the solid-state imaging unit,
• wherein the solid-state imaging unit includes
• a solid-state imaging device mounted on a substrate,
• a bonding wire which electrically connects a pad formed on the solid-state imaging device and a lead formed on the substrate,
• a frame member having a frame shape which surrounds side portions of the solid-state imaging device, and
• an optical member having optical transparency and mounted on the frame member so as to face the imaging surface of the solid-state imaging device,
• the frame member has a leg portion which protrudes from an optical member side toward the imaging surface of the solid-state imaging device,
• the frame member and the solid-state imaging device are integrally fixed to each other in a state where the leg portion comes into contact with an intermediate area which is located between an imaging area and a pad forming area on the imaging surface, and
• the frame member has a second leg portion which is connected to the leg portion, passes a side of the solid-state imaging device, and terminates without contacting the substrate.