Solid-state imaging apparatus and manufacturing method of solid-state imaging apparatus

A solid-state imaging apparatus comprising:

• a first semiconductor substrate;
• a second semiconductor substrate, wherein a front-side face of the first semiconductor substrate and the front-side face of the second semiconductor substrate face to each other;
• a wiring structure arranged between the first semiconductor substrate and the second semiconductor substrate;
• and
• a pad which is one of a plurality of pads to which a voltage is input from an exterior of the solid-state imaging apparatus, or from which a signal is output to an exterior of the solid-state imaging apparatus,
• wherein a first face of the pad is situated between the front-side face of the second semiconductor substrate and a hypothetical plane including and being parallel to the front-side face of the first semiconductor substrate, and a second face of the pad that is a face on the opposite side of the first face is situated between the first face and the front-side face of the second semiconductor substrate, and
• wherein one of the first and second semiconductor substrates includes a photoelectric conversion element, and the other of the first and second semiconductor substrates includes a semiconductor integrated circuit, and the second face is connected to a plurality of vias of one layer included in the wiring structure so that the pad is electrically connected to the semiconductor integrated circuit through the wiring structure.