Multilayer chip inductor and production method for same

A multilayer chip inductor comprising:

• a multilayer chip which comprises a laminate of roughly rectangular solid shape formed by stacking multiple insulator layers, in which a spiral coil pattern circling in a roughly rectangular shape along each side of the laminate is embedded;
• and
• external terminal electrodes provided on end faces of the multilayer chip, wherein the multiple insulator layers include:
• multiple first insulator layers on each of which a partial circling pattern is formed, wherein the spiral coil pattern is formed by interconnecting via through-holes ends of the partial circling patterns on the multiple first insulator layers, and each of four corners of the roughly rectangular shape of the spiral coil pattern constituted by the partial circling patterns is aligned as viewed from above;
• and
• a pair of second insulator layers provided at a top and bottom of the laminate of the multiple first insulator layers and on each of which a leader pattern is formed, where each leader pattern has:
• a leader part that is formed at a position not overlapping with the four corners of the spiral coil pattern as viewed from above and that is connected to the external terminal electrode,
• two connection parts that continue to the leader part and are aligned respectively with two of the four corners of the spiral coil pattern as viewed from above, and
• a cutout formed between the two connection parts by removing parts overlapping with the spiral coil pattern as viewed from above;
• wherein the partial circling pattern on a closest first insulator layer and the leader pattern are connected via a through-hole at only one of the two connection parts of the leader pattern.