Multi-chip package
AssigneeSK hynix Inc.
InventorJae-Bum Ko
Life of this patent
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Abstract
A multi-chip package having a plurality of slice chips coupled through a through-via, at least one slice chip may include an input unit suitable for receiving a slice activation signal, and outputting the slice activation signal to the through-via in response to a slice identification corresponding to the slice chip, a first output unit suitable for outputting the activation signal transferred through the through-via to an internal circuit of the slice chip in response to the corresponding slice identification, and a second output unit suitable for selectively outputting the activation signal transferred through the through-via to the internal circuit of the slice chip in a predetermined activation mode for the multi-chip package.
Claims8
A multi-chip package system, comprising:
- a multi-chip package having a plurality of slice chips coupled each other by using a first through-via and a second through-via,
- wherein at least one slice chip includes:
- a first signal transfer unit, and
- a second signal transfer unit, wherein the first signal transfer unit is suitable for transferring a first slice activation signal to the first through-via and an internal circuit of the slice chip, and the second signal transfer unit is suitable for transferring a second slice activation signal to the second through-via and the internal circuit of the slice chip;
- and
- a controller suitable for providing the first slice activation signal to the multi-chip package or the first and the second slice activation signals to the multi-chip package, and controlling a predetermined activation mode for the multi-chip package.
A multi-chip package having a plurality of slice chips coupled through a through-via, at least one slice chip comprising:
- a first signal transfer unit having a first output unit and a second output unit, wherein the second output unit is suitable for outputting a first slice activation signal transferred through a first through-via to an internal circuit of the slice chip in a predetermined activation mode for the multi-chip package;
- and
- a second signal transfer unit suitable for outputting a predetermined signal transferred through a second through-via to the internal circuit of the slice chip,
- wherein the second signal transfer unit includes:
- an output unit suitable for outputting the predetermined signal to the internal circuit;
- and
- a dummy output unit connected to the second through-via.
Dependencies are inferred from the claim text.