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US 8,947,105 B2Granted
Capacitive coupling of bond pads
AssigneeAtmel Corporation
InventorDavid Brent Guard
Life of this patent
Estimating the term…
Abstract
In one embodiment, a system includes a touch sensor comprising a first set of electrodes and a first set of bond pads electrically coupled to the first set of electrodes. The system also includes a second set of bond pads capacitively coupled to the first set of bond pads. Each bond pad of the second set of bond pads is coincident with a bond pad of the first set of bond pads. The system also includes a circuit electrically coupled to the second set of bond pads such that signals may be communicated from the first set of bond pads to the circuit.
Claims14
A system comprising:
- a touch sensor comprising a first set of electrodes located on a first side of the touch sensor;
- a first set of bond pads located on the first side of the touch sensor and electrically coupled to the first set of electrodes;
- a second set of bond pads capacitively coupled to the first set of bond pads, each bond pad of the second set of bond pads coincident with a bond pad of the first set of bond pads;
- a circuit electrically coupled to the second set of bond pads such that signals may be communicated from the first set of bond pads to the circuit;
- a second set of electrodes located on a second side of the touch sensor;
- and
- a third set of bond pads located on the second side of the touch sensor, the third set of bond pads electrically coupled to the second set of electrodes and electrically coupled to the circuit such that signals may be communicated from the third set of bond pads to the circuit.
4 more elements
A method comprising:
- electrically coupling a first set of bond pads to a first set of electrodes, a touch sensor comprising the first set of electrodes, the first set of bond pads and the first set of electrodes located on a first side of the touch sensor;
- capacitively coupling a second set of bond pads to the first set of bond pads, each bond pad of the second set of bond pads coincident with a bond pad of the first set of bond pads;
- electrically coupling a circuit to the second set of bond pads such that signals may be communicated from the first set of bond pads to the circuit;
- electrically coupling a third set of bond pads to a second set of electrodes, the touch sensor comprising the second set of electrodes, the second set of electrodes and the third set of bond pads located on a second side of the touch sensor;
- and
- electrically coupling the third set of bond pads to the circuit such that signals may be communicated from the third set of bond pads to the circuit.
3 more elements
A system comprising:
- a first set of bond pads electrically coupled to a first set of electrodes, the first set of electrodes comprised by a touch sensor, the first set of bond pads and the first set of electrodes located on a first side of the touch sensor;
- a second set of bond pads capacitively coupled to the first set of bond pads, each bond pad of the second set of bond pads coincident with a bond pad of the first set of bond pads;
- a second set of electrodes located on a second side of the touch sensor;
- a third set of bond pads located on the second side of the touch sensor, the third set of bond pads electrically coupled to the second set of electrodes;
- and
- wherein the second set of bond pads is electrically coupled to a circuit such that signals may be communicated from the first set of bond pads to the circuit and the third set of bond pads are electrically coupled to the circuit such that signals may be communicated from the third set of bond pads to the circuit.
3 more elements
Dependencies are inferred from the claim text.