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US 8,946,909 B2Granted
Semiconductor package having gap-filler injection-friendly structure
AssigneeSamsung Electronics Co., Ltd.
InventorsYun-rae Cho, Young-min Lee
Life of this patent
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Abstract
A semiconductor package may include a base substrate, a solder resist layer on the base substrate, a first semiconductor chip mounted on the base substrate, and a second semiconductor chip stacked on the first semiconductor chip. The second semiconductor chip may include at least one end portion protruding from the first semiconductor chip. The solder resist layer may include and a recess portion. The recess portion may be formed in the solder resist layer at a position corresponding to the at least one end portion of the second semiconductor chip.
Claims20
A semiconductor package comprising:
- a base substrate;
- a solder resist layer on the base substrate, the solder resist layer including a first recess portion;
- a first semiconductor chip on the base substrate;
- and
- a second semiconductor chip on the first semiconductor chip, the second semiconductor chip comprising at least one end portion protruding from the first semiconductor chip and overhanging the first recess portion.
2 more elements
Dependencies are inferred from the claim text.