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US 8,946,902 B2Granted
Device and method for manufacturing a device
AssigneeInfineon Technologies Austria AG
InventorMartin Vielemeyer
Life of this patent
Estimating the term…
Abstract
A device includes a semiconductor chip including a frontside, a backside, and a side surface extending from the backside to the frontside. The side surface includes a first region and a second region, wherein a level of the first region is different from a level of the second region. The device further includes an electrically conductive material arranged over the backside of the semiconductor chip and over the first region of the side surface, wherein the second region of the side surface is uncovered by the electrically conductive material.
Claims19
A device, comprising:
- a semiconductor chip comprising a frontside, a backside, and a side surface extending from the backside to the frontside, wherein the side surface comprises a first region and a second region, wherein a level of the first region is different from a level of the second region;
- and
- an electrically conductive material arranged over the backside of the semiconductor chip and over the first region of the side surface, wherein the second region of the side surface is uncovered by the electrically conductive material, wherein the first region or the second region comprises an undulation of the side surface, wherein the undulation comprises an amplitude from 100 nanometers to 5 micrometers.
A device, comprising:
- a semiconductor chip comprising a frontside, a backside, and a side surface extending from the backside to the frontside, wherein the side surface comprises a first region and a second region, wherein a level of the first region is different from a level of the second region, and wherein, in a direction from the backside to the frontside, a level of the side surface decreases from the first region to the second region;
- and
- an electrically conductive material arranged over the backside of the semiconductor chip and over the first region of the side surface, wherein the second region of the side surface is uncovered by the electrically conductive material.
Dependencies are inferred from the claim text.