Package on packaging structure and methods of making same

A package comprising:

• a first package having a first die formed on a first substrate, the first substrate having a plurality of thermal vias;
• a second package having a second die formed on a second substrate;
• and
• a solid thermal conductor interjacent the first package and second package and thermally coupling the second die to the first substrate, the solid thermal conductor being thermally coupled directly to the plurality of thermal vias, the solid thermal conductor passing no electrical signals between the first package and the second package.

A semiconductor device comprising:

• a first integrated circuit electrically and thermally connected to a first substrate;
• a first set of connectors thermally and electrically connecting the first substrate to a first side of a thermal coupler, the thermal coupler having a plurality of through vias;
• a second integrated circuit electrically connected to a second substrate and thermally connected to a second side of the thermal coupler, wherein the second die has a width less than a width of the thermal coupler;
• a second set of connectors electrically and thermally connecting the second substrate to the first substrate, electrical signals between the first substrate and the second substrate not passing through the thermal coupler.

A package comprising:

• a first package having a first die formed on a first substrate;
• a second package having a second die formed on a second substrate;
• and
• a solid thermal conductor interjacent the first package and second package and thermally coupling the second die to the first substrate, the solid thermal conductor having a plurality of through vias and passing no electrical signals between the first package and the second package;
• wherein the second die has a first width and the solid thermal conductor has a second width that is greater than the first width, wherein the second width is about 1.2 to 1.5 times as great as the first width.