Wafer level fan-out package with a fiducial die

A method for a semiconductor device, the method comprising:

• encapsulating a semiconductor die and a transparent fiducial die in a molding compound resin;
• forming passivation layers on a portion of an upper surface and a portion of a lower surface of the molding compound resin;
• forming a redistribution layer on an upper surface of the molding compound resin;
• forming a redistribution layer on a lower surface of the molding compound concurrently with a metal pattern on a lower surface of the transparent fiducial die, wherein the pattern is visible through an exposed upper surface of the transparent fiducial die;
• and
• forming a through mold via utilizing laser drilling wherein the metal pattern formed on the lower surface of the transparent fiducial die comprises a standard coordinate for the laser drilling and wherein the through mold via extends from the upper surface to the lower surface of the molding compound resin.

A semiconductor device comprising:

• a semiconductor die and a transparent fiducial die both encapsulated in a molding compound resin;
• passivation layers on an upper surface and a lower surface of the molding compound resin except where redistribution layers are formed on upper and lower surfaces of the molding compound resin;
• a metal pattern on a lower surface of the transparent fiducial die that is visible through an exposed upper surface of the transparent fiducial die;
• and
• a through mold via formed in the molding compound resin utilizing laser drilling recognizing the metal pattern as a standard coordinate, wherein said through mold via extends from the upper surface to the lower surface of the molding compound resin and is filled with metal for electrically coupling a redistribution layer on the upper surface of the molding compound resin to a redistribution layer on the bottom surface of the molding compound resin.