Packaged semiconductor device having multilevel leadframes configured as modules
AssigneeTexas Instruments Incorporated
InventorRichard J. Saye
Life of this patent
Estimating the term…
Abstract
A semiconductor system (100) has a first planar leadframe (101) with first leads (102) and pads (103) having attached electronic components (120), the first leadframe including a set of elongated leads (104) bent at an angle away from the plane of the first leadframe; a second planar leadframe (110) with second leads (112) and pads (113) having attached electronic components (114); the bent leads of the first leadframe conductively connected to the second leadframe, forming a conductively linked 3-dimensional network between components and leads in two planes; and packaging material (140) encapsulating the 3-dimensional network.
Claims12
A modular system in package semiconductor device with a plurality of interconnect levels comprising:
- a first pre-assembled modular subassembly comprising:
- a planar leadframe with set of first leads;
- pads having attached electronic components;
- and
- a first set of elongated leads bent in a first direction away from the plane of the planar leadframe;
- a second planar leadframe with second set of leads and pads having attached electronic components;
- the bent leads of the first pre-assembled modular subassembly leadframe conductively connected to the second planar leadframe, forming a conductively linked 3-dimensional network between attached electronic components and sets of leads in two planes;
- and
- packaging material encapsulating portions of the 3-dimensional network.
Dependencies are inferred from the claim text.