Packages and methods for 3D integration including two stacked dies with a portion of one die extending into a hole of the other die
AssigneeAnalog Devices, Inc.
InventorThomas Goida
Life of this patent
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Abstract
Packages and methods for 3D integration are disclosed. In various embodiments, a first integrated device die having a hole is attached to a package substrate. A second integrated device die can be stacked on top of the first integrated device die. At least a portion of the second integrated device die can extend into the hole of the first integrated device die. By stacking the two dies such that the portion of the second integrated device die extends into the hole, the overall package height can advantageously be reduced.
Claims32
A packaged integrated device comprising:
- a first integrated device die having a through hole;
- and
- a second integrated device die stacked on a surface of the first integrated device die, wherein a portion of the second integrated device die extends into the through hole of the first integrated device die.
A packaged integrated device comprising:
- a first integrated device die having a through hole;
- and
- a second integrated device die, wherein at least a portion of the second integrated device die extends into the through hole of the first integrated device die,
- wherein the portion of the second integrated device die that extends into the through hole is a thermally conductive heat sink configured to provide a heat path from the second integrated device die to a package substrate underlying the first integrated device die.
A packaged integrated device comprising:
- a first integrated device die having a through hole;
- a second integrated device die, wherein at least a portion of the second integrated device die extends into the through hole of the first integrated device die;
- and
- a package substrate electrically coupled to the first integrated device die, wherein the package substrate comprises a molded leadframe structure, and wherein the first integrated device die is mounted to a die paddle of the molded leadframe structure.
A packaged integrated device comprising:
- a first integrated device die comprising a hole and circuitry surrounding the hole;
- and
- a second integrated device die stacked on a surface of the first integrated device die, wherein a portion of the second integrated device die extends into the hole of the first integrated device die.
A packaged integrated device comprising:
- a first integrated device die comprising a hole and circuitry surrounding the hole;
- and
- a second integrated device die coupled to the first integrated device die, wherein at least a portion of the second integrated device die extends into the hole of the first integrated device die,
- wherein the first integrated device die is a processor die, and wherein the second integrated device die is a microelectromechanical systems (MEMS) die.
An integrated circuit comprising:
- an integrated circuit die, wherein a portion of the integrated circuit die is patterned with circuitry, the integrated circuit die comprising a first electrical contact pad configured to electrically communicate with a second integrated device die and a second electrical contact pad configured to electrically communicate with a package substrate;
- and
- a hole in the integrated circuit die having a width of between about 900 micrometers and about 2.5 millimeters,
- wherein the first electrical contact pad is disposed nearer the hole than the second electrical contact pad.
An integrated device package comprising:
- a first integrated device die having a first male stacking feature;
- a second integrated device die having a first female stacking feature configured to receive the first male stacking feature;
- and
- wherein the first and second integrated device dies are disposed in a stacking configuration such that the first integrated device die is stacked on a surface of the second integrated device die, and wherein the first male stacking feature is received within the first female stacking feature.
Dependencies are inferred from the claim text.