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US 8,946,877 B2Granted
Semiconductor package including cap
AssigneeAvago Technologies General IP (Singapore) Pte. Ltd.
InventorsRick Snyder, Joel Philliber
Life of this patent
Estimating the term…
Abstract
A semiconductor package comprises: a substrate comprising a semiconductor device; a cap comprising a seal ring disposed over a surface of the cap; and a gap between the substrate and the surface of the cap. The seal ring comprises a tread comprising at least two columns.
Claims22
A semiconductor package, comprising:
- a substrate comprising a semiconductor device;
- a cap comprising a seal ring disposed over a surface of the cap, the seal ring comprising a tread comprising at least two columns, wherein one of the at least two columns has a greater width than a width of another of the at least two columns;
- and
- a gap between the substrate and the surface of the cap.
1 more element
A semiconductor package, comprising:
- a substrate comprising a p-type semiconductor, intrinsic (i) semiconductor, n-type semiconductor (PIN) diode;
- a cap comprising a seal ring disposed over a surface of the cap, the seal ring comprising a tread comprising at least two columns, wherein one of the at least two columns has a greater width than a width of another of the at least two columns;
- and
- a gap between the substrate and the surface of the cap.
1 more element
Dependencies are inferred from the claim text.