Packaged semiconductor devices including pre-molded lead-frame structures, and related methods and systems

A packaged semiconductor device, comprising:

• a pre-molded lead-frame structure including a group of lead-fingers;
• and
• an opaque molded structure that forms a first pre-molded cavity and a second pre-molded cavity and is molded around portions of each of the lead-fingers of the group of lead-fingers to thereby mechanically attach each of the lead-fingers of the group of lead fingers to the portion of the molded structure the forms the first pre-molded cavity;
• wherein the opaque molded structure includes pre-molded walls and a pre-molded floor that define the first and second pre-molded cavities;
• and
• wherein an upper surface of the pre-molded floor is substantially coplanar with a portion of an upper surface of each of the lead-fingers of the group of lead-fingers;
• a first semiconductor structure within the first pre-molded cavity of the pre-molded lead-frame structure, the first semiconductor structure including a top surface and a bottom surface;
• and
• bond wires that provide electrical connections between the first semiconductor structure and the lead-fingers of the group of lead-fingers of the pre-molded lead-frame structure;
• wherein a portion of the upper surface of each of the lead-fingers of the group of lead-fingers of the pre-molded lead-frame structure is mechanically attached to the bottom surface of the first semiconductor structure to inhibit relative mechanical motion between the first semiconductor structure, the molded structure and each of the lead-fingers of the group of lead-fingers of the pre-molded lead-frame structure;
• a second semiconductor structure within the second pre-molded cavity of the pre-molded lead-frame structure;
• and
• a fill material that encapsulates the first semiconductor structure within the first pre-molded cavity of the pre-molded lead-frame structure and encapsulates the second semiconductor structure within the second pre-molded cavity of the pre-molded lead-frame structure.