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US 8,946,873 B2Granted
Redistribution structures for microfeature workpieces
AssigneeMicron Technology, Inc.
InventorMark S. Johnson
Life of this patent
Estimating the term…
Abstract
Microfeature dies with redistribution structures that reduce or eliminate line interference are disclosed. The microfeature dies can include a substrate having a bond site and integrated circuitry electrically connected to the bond site. The microfeature dies can also include and a redistribution structure coupled to the substrate. The redistribution structure can include an external contact site configured to receive an electric coupler, a conductive line that is electrically connected to the external contact site and the bond site, and a conductive shield that at least partially surrounds the conductive line.
Claims22
A microfeature die, comprising:
- a substrate having a bond site and integrated circuitry electrically coupled to the bond site;
- a redistribution structure coupled to the substrate, the redistribution structure having an external contact site configured to receive an electric coupler;
- a conductive line having a transmission length, wherein the conductive line is electrically connected to the external contact site and the bond site;
- a conductive shield at least partially surrounding the conductive line along at least a portion of the transmission length of the conductive line, wherein the conductive shield includes a first metal layer and a second metal layer electricity coupled to the first metal layer;
- wherein the redistribution structure further includes a first dielectric layer positioned between the substrate and the first metal layer, a second dielectric layer positioned between the first metal layer and the conductive line, and an opening extending through the first dielectric layer, through the first metal layer, and through the second dielectric layer;
- and
- wherein the conductive line extends through the opening, and the second dielectric layer electricity isolates the conductive line from the first metal layer.
4 more elements
A microfeature die, comprising:
- a substrate having a bond site and integrated circuitry electrically connected to the bond site;
- a redistribution structure coupled to the substrate, the redistribution structure having an external contact site configured to receive an electric coupler;
- a conductive line electrically connecting the external contact site to the bond site;
- a first metal layer and a second metal layer electrically coupled to the first metal layer, wherein at least a portion of the first and second metal layers surrounds the conductive line along at least a portion of a length of the conductive line;
- wherein the redistribution structure further includes a first dielectric layer on a surface of the substrate, a second dielectric layer on the first metal layer, and an opening formed in the first and second dielectric layers;
- and
- wherein the conductive line includes a first portion extending from the opening of the first and second dielectric layers and a second portion in the opening of the first and second dielectric layers, and wherein a portion of the second dielectric layer electrically insulates the first metal layer from the second portion of the conductive line.
4 more elements
A microfeature die, comprising:
- a substrate having a bond site, integrated circuitry electrically connected to the bond site;
- a redistribution structure coupled to the substrate, the redistribution structure having an external contact site configured to receive an electric coupler;
- a conductive trace electrically connecting the external contact site to the bond site;
- a shield enclosing at least a portion of the conductive trace, the shield being electrically conductive and grounded and including a first metal layer and a second metal layer electrically coupled to the first metal layer, at least a portion of the first and second metal layers surrounding the conductive trace along at least a portion of a length of the conductive trace;
- wherein the redistribution structure further includes a first dielectric layer on a surface of the substrate, a second dielectric layer on the first metal layer, and an opening in the first and second dielectric layers;
- and
- wherein the conductive trace includes a first portion extending from the opening of the first and second dielectric layers and a second portion in the opening of the first and second dielectric layers, a portion of the second dielectric layer electrically insulating the first metal layer from the second portion of the conductive trace.
4 more elements
Dependencies are inferred from the claim text.