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US 8,946,869 B2Granted
Integrated circuit for detecting defects of through chip via
AssigneeSK hynix Inc.
InventorsDae-Suk Kim, Jong-Chern Lee, Chul Kim
Life of this patent
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Abstract
An integrated circuit that detects whether a through silicon via has defects or not, at a wafer level. The integrated circuit includes a semiconductor substrate, a through silicon via configured to be formed in the semiconductor substrate to extend to a certain depth from the surface of the semiconductor substrate, an output pad, and a current path providing unit configured to provide a current, flowing between the semiconductor substrate and the through silicon via, to the output pad during a test mode.
Claims8
An integrated circuit comprising:
- a semiconductor substrate;
- a silicon via extending into the semiconductor substrate to a certain depth from the surface of the semiconductor substrate;
- an output pad formed on the semiconductor substrate;
- and
- a current path providing unit, formed in the semiconductor substrate, configured to establish a current path and provide a current, flowing from the semiconductor substrate and through the silicon via, to the output pad during a test mode,
- wherein a first voltage is applied to a first well region of the semiconductor substrate during the test mode, the first voltage being greater than a schottky potential barrier formed at contact interface between a bottom of the silicon via and the semiconductor substrate.
3 more elements
Dependencies are inferred from the claim text.