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US 8,946,852 B2Granted
Photosensitive resin composition, photosensitive resin composition film, and semiconductor device using the photosensitive resin composition or photosensitive resin composition film
AssigneeToray Industries, Inc.
InventorHiroyuki Niwa
Life of this patent
Estimating the term…
Abstract
A photosensitive resin composition contains: (a) an alkali-soluble polyimide; (b) a compound which has two or more epoxy groups and/or oxetanyl groups in each molecule; and (c) a quinonediazide compound. Less than 10 parts by weight of an acrylic resin is contained per 100 parts by weight of the polyimide (a); and the content of the compound (b) is not less than 20 parts by weight per 100 parts by weight of the polyimide (a).
Claims15
A photosensitive resin composition comprising:
- (a) an alkali-soluble polyimide which has a structural unit represented by general formula (1), while having a structure represented by general formula (2) and/or (3) at least one end of the main chain;
- (b) at least one compound selected from a bisphenol A-type epoxy compound, a novolac-type epoxy compound, a biphenyl-type epoxy compound and a glycidyl amine-type epoxy compound;
- and (c) a quinonediazide compound, wherein the content of the compound (b) is not less than 20 parts by weight per 100 parts by weight of the polyimide (a)
- wherein X is derived from a primary monoamine which is an end capping agent and represents a monovalent organic group having at least one selected from the group consisting of a carboxyl group, a phenolic hydroxyl group, a sulfonic acid group and a thiol group, and Y is derived from a dicarboxylic anhydride which is an end capping agent and represents a divalent organic group having at least one selected from the group consisting of a carboxyl group, a phenolic hydroxyl group, a sulfonic acid group and a thiol group;
- and
- wherein R1 represents a tetra- to tetradeca-valent organic group, R2 represents a di- to dodeca-valent organic group, and R3 and R4 each independently represents at least one group selected from the group consisting of a carboxyl group, a phenolic hydroxyl group, a sulfonic acid group and a thiol group, α and β each independently represents an integer of 0 to 10.
3 more elements
A photosensitive resin composition film comprising:
- (a) an alkali-soluble polyimide which has a structural unit represented by general formula (1), while having a structure represented by general formula (2) and/or (3) at least one end of the main chain;
- (b) at least one compound selected from a bisphenol A-type epoxy compound, a novolac-type epoxy compound, a biphenyl-type epoxy compound and a glycidyl amine-type epoxy compound;
- and (c) a quinonediazide compound, wherein the content of the compound (b) is not less than 20 parts by weight per 100 parts by weight of the polyimide (a),
- wherein X is derived from a primary monoamine which is an end capping agent and represents a monovalent organic group having at least one selected from the group consisting of a carboxyl group, a phenolic hydroxyl group, a sulfonic acid group and a thiol group, and Y is derived from a dicarboxylic anhydride which is an end capping agent and represents a divalent organic group having at least one selected from the group consisting of a carboxyl group, a phenolic hydroxyl group, a sulfonic acid group and a thiol group;
- and
- wherein R1 represents a tetra- to tetradeca-valent organic group, R2 represents a di- to dodeca-valent organic group, and R3 and R4 each independently represents at least one group selected from the group consisting of a carboxyl group, a phenolic hydroxyl group, a sulfonic acid group and a thiol group, α and β each independently represents an integer of 0 to 10.
3 more elements
Dependencies are inferred from the claim text.