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US 8,946,833 B2Granted
Packaging for semiconductor sensor devices and methods
AssigneeFreescale Semiconductor, Inc.
InventorLeo M. Higgins, III
Life of this patent
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Abstract
A pressure sensor includes a first housing having a cavity. The pressure sensor further includes a pressure sensing device attached to a bottom of the cavity. The pressure sensor further includes a layer of gel over the pressure sensing device. The pressure sensor further includes a baffle in contact with the gel to reduce movement of the gel.
Claims16
A pressure sensor, comprising:
- a first housing having a cavity;
- a pressure sensing device attached to a bottom of the cavity;
- an electrical connection coupled between the pressure sensing device and another component in the cavity;
- a layer of gel, the pressure sensing device and at least a portion of the electrical connection being buried in the layer of gel;
- a lid over the layer of gel;
- and
- a baffle in the cavity in contact with the layer of gel to reduce movement of the gel across the electrical connection.
4 more elements
A pressure sensor, comprising:
- a first housing having a cavity;
- a pressure sensing device attached to a bottom of the cavity;
- an electrical connection in the cavity between the pressure sensing device and another component;
- a layer of low modulus gel in the cavity, the pressure sensing device and at least a portion of the electrical connection are buried in the gel;
- a lid over the layer of low modulus gel;
- and
- a baffle for moderating movement of the gel across the electrical connection and the pressure sensing device, wherein the baffle is in contact with the layer of low modulus gel in the cavity.
4 more elements
Dependencies are inferred from the claim text.