Gallium nitride semiconductor substrate
AssigneeSumitomo Electric Industries, Ltd.
InventorMasaki Ueno
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AssigneeSumitomo Electric Industries, Ltd.
InventorMasaki Ueno
Estimating the term…
A method of fabricating a single crystal gallium nitride substrate the step of cutting an ingot of single crystal gallium nitride along predetermined planes to make one or more single crystal gallium nitride substrates. The ingot of single crystal gallium nitride is grown by vapor phase epitaxy in a direction of a predetermined axis. Each predetermined plane is inclined to the predetermined axis. Each substrate has a mirror polished primary surface. The primary surface has a first area and a second area. The first area is between an edge of the substrate and a line 3 millimeter away from the edge. The first area surrounds the second area. An axis perpendicular to the primary surface forms an off-angle with c-axis of the substrate. The off-angle takes a minimum value at a first position in the first area of the primary surface.
A gallium nitride substrate with a primary surface for epitaxial growth of a III nitride semiconductor, the gallium nitride substrate, wherein:
A gallium nitride substrate with a primary surface for epitaxial growth of a III nitride semiconductor, the gallium nitride substrate, wherein:
A gallium nitride substrate with a primary surface for epitaxial growth of a III nitride semiconductor, the gallium nitride substrate, wherein:
Dependencies are inferred from the claim text.