Light emitting diode and light emitting diode package

A light emitting diode package comprising:

• a package substrate;
• a second semiconductor layer, an active layer, a first semiconductor layer, and a transparent substrate sequentially stacked on the package substrate;
• a first electrode connected to the first semiconductor layer;
• a second electrode connected to the second semiconductor layer;
• and
• bumps connecting the first and second electrodes to the package substrate,
• wherein the first electrode comprises:
• an edge electrode having a closed loop-shape extending along a periphery of the first semiconductor layer, the edge electrode including a first edge portion and a second edge portion opposite to each other;
• and
• a plurality of first line portions extending from the first edge portion and a second line portion extending from the second edge portion;
• wherein a distance of each of the first line portions from the second edge portion is equal to or less than a quarter of a length of each of the first line portions,
• wherein a distance between the second line portion and the first edge portion is equal to or less than a quarter of a length of the second line portion,
• wherein each of the plurality of first line portions includes a separate pad portion adjacent to the edge electrode, and the second line portion includes a pad portion adjacent to the edge electrode,
• wherein the second line portion extends in a lengthwise direction from the pad portion of the second line portion, the width of the second line portion is maintained to be greater than the width of each first line portion extending in the lengthwise direction from the pad portion of said each first line portion and the width of the second line portion is greater than a width of the edge electrode, and an area occupied by the second line portion is greater than an area occupied by each first line portion.