Radiation-emitting semiconductor chip and method for producing a radiation-emitting semiconductor chip
AssigneeOSRAM Opto Semiconductors GmbH
InventorsDieter Eissler, Andreas Ploessl
Life of this patent
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Abstract
A radiation-emitting semi-conductor chip has a substrate and a semiconductor body arranged on the substrate and with a semiconductor layer sequence that includes an active region provided for producing radiation, an n-type region, and a covering layer arranged on a side of the n-type region that faces away from said active region. There is a contact structure arranged on the covering layer for the external electrical contacting of the n-type region. The covering layer has at least one recess through which the contact structure extends to the n-type region.
Claims15
A radiation-emitting semiconductor chip comprising:
- a carrier;
- a semiconductor body disposed on the carrier and having a semiconductor layer sequence that includes an active region configured to generate radiation, an n-conducting region and a cover layer disposed on a side of the n-conducting region facing away from the active region;
- and
- a contact structure for contacting the n-conducting region disposed on the cover layer, wherein the cover layer has a cut-out through which the contact structure extends to the n-conducting region, wherein the contact structure has a contact surface on a side facing away from the active region, wherein the contact surface overlaps in a plan view of the semiconductor chip with the cut-out, and wherein the contact surface has a protrusion or a depression.
A method for producing a plurality of semiconductor chips, the method comprising:
- providing a semiconductor layer sequence on a substrate, the semiconductor layer sequence comprising a cover layer, an active region configured to generate radiation, and an n-conducting region;
- attaching the semiconductor layer sequence to a carrier;
- removing the substrate;
- forming cut-outs in the cover layer;
- forming a contact structure on the cover layer, wherein the contact structure extends into the cut-outs, wherein the contact structure has contact surfaces on a side facing away from the active region, wherein the contact surfaces overlap in a plan view of the semiconductor chips the cut-outs, and wherein the contact surfaces have protrusions or depressions;
- and
- separating the semiconductor layer sequence with the carrier into the plurality of semiconductor chips, so that each semiconductor chip has at least one of the cut-outs.
Dependencies are inferred from the claim text.