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US 8,946,757 B2Granted
Heat spreading substrate with embedded interconnects
AssigneeInvensas Corporation
InventorsIlyas Mohammed, Masud Beroz
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Abstract
Heat spreading substrate with embedded interconnects. In an embodiment in accordance with the present invention, an apparatus includes a metal parallelepiped comprising a plurality of wires inside the metal parallelepiped. The plurality of wires have a different grain structure than the metal parallelepiped. The plurality of wires are electrically isolated from the metal parallelepiped. The plurality of wires may be electrically isolated from one another.
Claims16
An apparatus comprising:
- a substrate comprising a plurality of wire bond pads;
- a plurality of bond wires coupled to the wire bond pads;
- a metal parallelepiped over the substrate and encompassing the plurality of bond wires;
- at least two light emitting diodes mounted on said mental parallelepiped;
- wherein said plurality of wires have a different grain structure than said metal parallelepiped;
- and
- wherein said plurality of wires is electrically isolated from said metal parallelepiped.
4 more elements
Dependencies are inferred from the claim text.