Lead, wiring member, package part, metal part provided with resin and resin-sealed semiconductor device, and methods for producing same

A wiring member with metal leads having an organic film that is formed through self-assembly by an organic compound and that adheres to surfaces thereof, wherein

• the organic compound has a structure such that the following (i) and (ii) are each arranged therein:
• (i) at an extremity of a principal chain, a first functional group that imparts bonding capability by which formation of any among metallic bonds, hydrogen bonds, and coordinate bonds via metal compounds, is made possible with respect to the leads, and (ii) at another extremity of the principal chain, a second functional group that causes or enhances resin hardening,
• the principal chain of the organic compound comprises:
• one or more chains selected from the group consisting of a methylene chain, a fluoromethylene chain, a siloxane chain, and a glycol chain;
• and
• one or more skeletons selected from the group consisting of an aromatic imide skeleton and an amide skeleton, and
• the first functional group bonds with the leads.

A wiring member with metal leads having an organic film that is formed through self-assembly by an organic compound and that adheres to surfaces thereof, wherein

• the organic compound has a structure such that the following (i) and (ii) are each arranged therein:
• (i) at an extremity of a principal chain, a first functional group that imparts bonding capability by which formation of any among metallic bonds, hydrogen bonds, and coordinate bonds via metal compounds, is made possible with respect to the leads, and (ii) at another extremity of the principal chain, a second functional group that causes or enhances resin hardening,
• the principal chain of the organic compound comprises:
• a N-containing heterocycle containing two or more N atoms, and
• the first functional group bonds with the leads.

A wiring member with metal leads having an organic film that is formed through self-assembly by an organic compound and that adheres to surfaces thereof, wherein

• the organic compound has a structure such that the following (i) and (ii) are each arranged therein:
• (i) at an extremity of a principal chain, a first functional group that imparts bonding capability by which formation of any among metallic bonds, hydrogen bonds, and coordinate bonds via metal compounds, is made possible with respect to the leads, and (ii) at another extremity of the principal chain, a second functional group that causes or enhances resin hardening,
• the principal chain of the organic compound comprises one or more skeletons selected from the group consisting of an aryl skeleton, an acene skeleton, a pyrene skeleton, a phenanthrene skeleton, and a fluorene skeleton, and
• the first functional group bonds with the leads.