Light emitting diode and manufacturing method thereof
AssigneeAdvanced Optoelectronic Technology, Inc.
InventorsYa-Wen Lin, Po-Min Tu, Shih-Cheng Huang, Chia-Hung Huang, Shun-Kuei Yang
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AssigneeAdvanced Optoelectronic Technology, Inc.
InventorsYa-Wen Lin, Po-Min Tu, Shih-Cheng Huang, Chia-Hung Huang, Shun-Kuei Yang
Estimating the term…
A light emitting diode (LED) includes a substrate, a buffer layer and an epitaxial structure. The substrate has a first surface with a patterning structure formed thereon. The patterning structure includes a plurality of projections. The buffer layer is arranged on the first surface of the substrate. The epitaxial structure is arranged on the buffer layer. The epitaxial structure includes a first semiconductor layer, an active layer and a second semiconductor layer arranged on the buffer layer in sequence. The first semiconductor layer has a second surface attached to the active layer. A distance between a peak of each the projections and the second surface of the first semiconductor layer is ranged from 0.5 μm to 2.5 μm.
A light emitting diode (LED) comprising:
A method for manufacturing the LED, comprising:
Dependencies are inferred from the claim text.