Method for packaging light emitting diodes and light emitting module having LED packages formed by the method
AssigneeAdvanced Optoelectronic Technology, Inc.
InventorHsing-Fen Lo
Life of this patent
Estimating the term…
Abstract
A method for making a light emitting module includes: a. providing a flexible substrate; b. forming a plurality of rigid portions in the flexible substrate; c. forming an electrically conductive layer on the rigid portions, the electrically conductive layer having several electrodes apart from each other; d. arranging a plurality of LED dies on the electrically conductive layer with each LED die striding over and electrically connected to two neighboring electrodes; e. forming an encapsulating layer to cover the LED dies; and f. cutting through the flexible substrate. At least one of above steps b, c, d, e is performed by a roll applying process.
Claims8
A method for making a light emitting module, comprising steps of:
- a. providing a flexible substrate;
- b. forming a plurality of rigid portions in the flexible substrate;
- c. forming an electrically conductive layer on the rigid portions, the electrically conductive layer having several electrodes apart from each other and each electrode striding over two neighboring rigid portions;
- d. arranging a plurality of LED dies on the electrically conductive layer with each LED die striding over and electrically connected to two neighboring electrodes;
- e. forming an encapsulating layer to cover the LED dies;
- and
- f. cutting through the flexible substrate to obtain the light emitting module which includes at least two rigid portions and at least two LED dies over the at least two rigid portions, wherein at least one of above steps b, c, d is performed by a roll applying process.
Dependencies are inferred from the claim text.