Semiconductor device
AssigneeRenesas Electronics Corporation
InventorsBunji Yasumura, Fumio Tsuchiya, Hisanori Ito, Takuji Ide, Naoki Kawanabe, Masanao Sato
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Abstract
A technique is provided that can prevent cracking of a protective film in the uppermost layer of a semiconductor device and improve the reliability of the semiconductor device. Bonding pads formed over a principal surface of a semiconductor chip are in a rectangular shape, and an opening is formed in a protective film over each bonding pad in such a manner that an overlapping width of the protective film in a wire bonding region of each bonding pad becomes wider than an overlapping width of the protective film in a probe region of each bonding pad.
Claims23
A semiconductor device, comprising:
- a semiconductor chip having a principal surface on which a plurality of bonding pads are disposed and a back surface opposite the principal surface,
- wherein the principal surface of the semiconductor chip is covered by a protective film in which a plurality of openings are formed,
- wherein a peripheral portion of an upper surface each of the bonding pads is covered by the protective film and a portion other than the peripheral portion of the upper surface of each of the bodings pads is exposed from a corresponding one of the openings,
- wherein the upper surface of each of the bonding pads is sectioned into a bonding region and a probe region, and
- wherein, in a plan view, an overlapping width of the protective film and the peripheral portion of each of the bonding pads in the bonding region is wider than an overlapping width of the protective film and the peripheral portion of each of the bonding pads in the probe region.
A semiconductor device comprising:
- a semiconductor chip having a main surface over which a plurality of bonding pads are formed;
- and
- a wiring member having a top surface over which the semiconductor chip is mounted and is electrically connected to the semiconductor chip,
- wherein a peripheral portion of an obverse surface of each of the bonding pads is covered by an insulating film in which a plurality of openings are formed, and a portion other than the peripheral portion of the upper surface of each of the bonding pads is exposed from a corresponding one of the openings,
- wherein the obverse surface of each of the bonding pads is sectioned into a bonding region and a probe region, and
- wherein, in a plan view, an overlapping width of the insulating film and the peripheral portion of each of the bonding pads in the bonding region is wider than an overlapping width of the insulating film and the peripheral portion of each of the bonding pads in the probe region.
Dependencies are inferred from the claim text.