Optical sensor device having wiring pattern within cavity housing optical sensor element
AssigneeSeiko Instruments Inc.
InventorsKoji Tsukagoshi, Hitoshi Kamamori, Sadao Oku, Hiroyuki Fujita, Keiichiro Hayashi
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Abstract
A low-cost, compact, high-reliability optical sensor device has an optical sensor element mounted in a package comprised of a light shielding glass lid substrate, a part of which has a light filter function, adhered to a light shielding glass substrate having a cavity. In a through hole in the light shielding glass lid substrate, glass having a function of absorbing infrared light and transmitting visible light by its own property is embedded. The light shielding glass substrate is made of glass having light shielding property as its own property.
Claims20
An optical sensor device, comprising:
- a light shielding glass substrate having a cavity in a surface thereof;
- a glass lid substrate disposed on and adhered to the light shielding glass substrate to cover the cavity, a part of the glass lid substrate having a light filter function;
- a first wiring pattern formed on a surface of the glass lid substrate that faces the cavity;
- an optical sensor element disposed in the cavity and electrically connected to the first wiring pattern;
- a second wiring pattern formed on the light shielding glass substrate and extending along the cavity surface from an upper end surface of the cavity, where the second wiring pattern is electrically connected to the first wiring pattern, to a bottom surface of the cavity;
- a third wiring pattern formed on a surface of the light shielding glass substrate that is opposite to the surface having the cavity;
- and
- a through electrode extending through the light shielding glass substrate and electrically connected at one end thereof to the second wiring pattern at the bottom surface of the cavity and at another end thereof to the third wiring pattern.
Dependencies are inferred from the claim text.