Back to results
US 8,946,587 B2Granted
Laser machining apparatus
AssigneeHonda Motor Co., Ltd.
InventorsTakuo Kobayashi, Shin Yoshida, Izuru Hori, Masahiro Koike, Kenichi Fukami
Life of this patent
Estimating the term…
Abstract
A laser machining apparatus is provided with: a workpiece support unit; a machining head; and a machining head moving unit. The workpiece support unit includes: an end support part that supports a width end of a workpiece; and an inside support part that supports an inside portion of the workpiece in a width direction. The end support part is movable in a longitudinal direction independently from the inside support part in response to a movement of the machining head.
Claims3
A laser machining apparatus comprising:
- a workpiece support unit that supports a workpiece having a predetermined width;
- a machining head that radiates a laser beam while ejecting an assist gas on a portion to be machined;
- and
- a machining head moving unit that moves the machining head along a machining path on the workpiece supported by the workpiece support unit,
- wherein the workpiece support unit includes:
- an end support part that supports a width end of the workpiece;
- and
- an inside support part that supports an inside portion of the workpiece in a width direction,
- wherein the end support part is movable in a longitudinal direction of the workpiece independently from the inside support part in response to a movement of the machining head, the end support part being synchronized with the movement of the machining head and corresponding to a position of the machining head in the longitudinal direction of the workpiece.
6 more elements
Dependencies are inferred from the claim text.