Module with exposed parts of copper foil and process for production thereof

A module comprising:

• a circuit board including:
• an insulating layer;
• upward inner layer wiring including copper foil whose glossy surface faces upward;
• downward inner layer wiring including copper foil whose glossy surface faces downward;
• upper-surface wiring;
• and
• rear-surface wiring;
• an electronic component mounted on the upper-surface wiring;
• a sealing part sealing the electronic component;
• and
• a metal film covering a side surface of the circuit board and a surface of the sealing part,
• wherein the upward inner layer wiring is exposed to the lateral surface of the circuit board by exposed parts which include a first sagging portion, and the downward inner layer wiring is exposed to the side surface of the circuit board by exposed parts which include a second sagging portion, and
• the metal film includes:
• a base electrode layer including any one of Ti, Ni, and Cr;
• and
• a copper electrode layer including 90 wt % or more of copper,
• wherein a plurality of the exposed parts of the upward inner layer wiring or the downward inner layer wiring are provided adjacent to each other on the same plane and are separated from each other with a distance that is not less than the thickness of the copper foil, and a total of the widths of the exposed parts of the copper foil of the upward inner layer wiring or the downward inner layer wiring is 20% or more and 75% or less with respect to an entire periphery of the module.