Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device
AssigneeDow Corning Toray Co., Ltd.
InventorsMakoto Yoshitake, Takashi Sagawa, Masayoshi Terada
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Abstract
A hydrosilylation reaction-curable organopolysiloxane composition comprising (A) a methylpheny-lalkenylpolysiloxane that has at least two alkenyl groups wherein diphenylsiloxane units are no more than 5 mole % and at least 20 mole % is comprised of phenyl groups, (B) a methylphenylhydrogenpolysiloxane that has at least two Si-bonded hydrogen atoms wherein diphenylsiloxane units are no more than 5 mole % and at least 20 mole % is comprised of phenyl groups, and (C) a hydrosilylation reaction catalyst. An optical semiconductor element sealant comprising this composition. An optical semiconductor device sealed with this optical semiconductor element sealant.
Claims18
A hydrosilylation reaction-curable organopolysiloxane composition comprising
- (A) a methylphenylalkenylpolysiloxane that has at least two silicon-bonded alkenyl groups per molecule, wherein diphenylsiloxane units are no more than 5 mole % of the total siloxane units and phenyl groups are at least 20 mole % of the total silicon-bonded organic groups in the molecule,
- (B) a methylphenylhydrogenpolysiloxane that has at least two silicon-bonded hydrogen atoms per molecule, wherein diphenylsiloxane units are no more than 5 mole % of the total siloxane units and phenyl groups are at least 20 mole % of the total silicon-bonded organic groups in the molecule, and
- (C) a hydrosilylation reaction catalyst,
- wherein the diphenylsiloxane units are no more than 5 mole % of the total siloxane units in this composition.
Dependencies are inferred from the claim text.