Adhesive composition for semiconductors, adhesive film prepared using the same, and semiconductor device including the film
AssigneeCheil Industries Inc.
InventorsBaek Soung Park, Ki Tae Song, In Hwan Kim
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Abstract
An adhesive composition for semiconductors, an adhesive film prepared using the adhesive composition, and a semiconductor device including the adhesive film, the adhesive composition exhibiting two exothermic peaks at temperatures ranging from 65° C. to 350° C., wherein a first exothermic peak appears at a lower temperature than a second exothermic peak, and the adhesive composition has a curing rate of about 70% to 100% in a first exothermic peak zone, as calculated by Equation 1: Curing rate=[(Heating value upon 0 cycle−Heating value after 1 cycle)/Heating value upon 0 cycle]×100.
Claims21
An adhesive composition for semiconductors, the adhesive composition exhibiting two exothermic peaks at temperatures ranging from 65° C. to 350° C., wherein:
- a first exothermic peak appears at a lower temperature than a second exothermic peak, and
- the adhesive composition has a curing rate of about 70% to 100% in a first exothermic peak zone, as calculated by Equation 1:
- Curing rate=[(Heating value upon 0 cycle−Heating value after 1 cycle)/Heating value upon 0 cycle]×100.
An adhesive composition for semiconductors, the adhesive composition exhibiting two exothermic peaks at temperatures ranging from 65° C. to 350° C., wherein:
- a first exothermic peak appears at a lower temperature than a second exothermic peak, and
- the adhesive composition has a void proportion of 15% or less after 1 cycle.
An adhesive composition for semiconductors, the adhesive composition exhibiting two exothermic peaks at temperatures ranging from 65° C. to 350° C., wherein:
- a first exothermic peak appears at a lower temperature than a second exothermic peak, and
- the adhesive composition has a peak height reduction rate of about 70% to 100% in a first exothermic peak zone, as calculated by Equation 2:
- Peak height reduction rate=[(Peak height upon 0 cycle−Peak height after 1 cycle)/Peak height upon 0 cycle]×100.
An adhesive composition for semiconductors, the adhesive composition exhibiting two exothermic peaks at temperatures ranging from 65° C. to 350° C., wherein:
- a first exothermic peak appears at a lower temperature than a second exothermic peak, and
- the adhesive composition has a curing rate of about 70% to 100% in a first exothermic peak zone, as calculated by Equation 1:
- Curing rate=[(Heating value upon 0 cycle−Heating value after 1 cycle)/Heating value upon 0 cycle]×100
- and wherein the adhesive composition includes:
- a thermoplastic resin,
- an epoxy resin,
- curing agents, the curing agents include a phenolic curing agent and an amine curing agent, and
- a curing catalyst, the curing catalyst includes a phosphorus-containing catalyst.
Dependencies are inferred from the claim text.