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US 8,946,099 B2Granted
Transponder embedded in a flexible multilayer support
AssigneeHID Global Corporation
InventorManfred Michalk
Life of this patent
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Abstract
The transponder with an electronic unit comprising an antenna coil (4) connected to a chip module (5) embedded in a multi-layer laminate support (1) comprises at least one flexible thermoplastic layer (2) disposed on both sides of the electronic unit wherein the multi-layer laminate support further comprises a non-woven foil (3) with a grammage of less than 25 g/m2.
Claims10
A transponder, comprising:
- an antenna coil;
- a chip module connected to the antenna coil;
- and
- a laminate structure, comprising:
- a first thermoplastic layer;
- a second thermoplastic layer;
- and
- a porous non-woven foil with a grammage of less than 25 g/m2, the porous non-woven foil consisting of non-woven fibers substantially lacking hydrogen bonds, wherein at least some material from the first thermoplastic layer penetrates the porous non-woven foil between the non-woven fibers and the penetrating material bonds directly with at least some material from the second thermoplastic layer during lamination of the first thermoplastic layer, second thermoplastic layer, and the porous non-woven foil, and
- wherein the antenna coil and chip module are both embedded in the laminate structure.
6 more elements
Dependencies are inferred from the claim text.