Imprint method, imprint apparatus, and method of manufacturing semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorShinji Mikami
Life of this patent
Estimating the term…
Abstract
In an imprint method of an embodiment, in the imprinting of an imprint shot including an outermost peripheral region of a substrate where resist is not desired to be entered at the time of imprinting, light curing the resist is applied to a light irradiation region with a predetermined width including a boundary between the outermost peripheral region and a pattern formation region more inside than the outermost peripheral region, whereby the resist which is to enter inside the outermost peripheral region is cured. Then, light curing the resist filled in a template pattern is applied onto a template.
Claims11
An imprint method, comprising:
- dropping resist in a pattern formation region more inside than an outermost peripheral region which is a region on a substrate where the resist is not desired to be entered at the time of imprinting;
- pressing a template pattern of a template against the resist on the substrate for each imprint shot and thereby filling the resist in the template pattern for each imprint shot;
- in the imprinting of the imprint shot including the outermost peripheral region, when the template pattern is pressed against the resist, applying first light curing the resist to a light irradiation region with a predetermined width including a boundary between the outermost peripheral region and the pattern formation region and curing the resist which is to enter inside the outermost peripheral region;
- and
- applying second light, curing the resist filled in the template pattern, onto the template.
A method of manufacturing a semiconductor device, comprising:
- dropping resist in a pattern formation region more inside than an outermost peripheral region which is a region on a substrate where the resist is not desired to be entered at the time of imprinting;
- pressing a template pattern of a template against the resist on the substrate for each imprint shot and thereby filling the resist in the template pattern for each imprint shot;
- in the imprinting of the imprint shot including the outermost peripheral region, when the template pattern is pressed against the resist, applying first light curing the resist to a light irradiation region with a predetermined width including a boundary between the outermost peripheral region and the pattern formation region and curing the resist which is to enter inside the outermost peripheral region;
- applying second light, curing the resist filled in the template pattern, onto the template;
- and
- processing the substrate from above of cured resist and thereby forming a pattern on substrate, corresponding to the template pattern, on the substrate.
Dependencies are inferred from the claim text.