No-flow underfill for package with interposer frame
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorJiun Yi Wu
Life of this patent
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Abstract
Mechanisms of forming a package on package (PoP) package by using an interposer and an no-reflow underfill (NUF) layer are provided. The interposer frame improves the form factor of the package, enables the reduction in the pitch of the bonding structures. The NUF layer enables a semiconductor die and an interposer frame be bonded to a substrate by utilizing the heat on the connectors of the semiconductor die and on the connectors of the interposer frame for bonding. The heat provided by the semiconductor die and the interposer frame also transforms the NUF layer into an underfill. PoP structures formed by using the interposer frame and the NUF layer improve yield and have better reliability performance.
Claims21
A method of forming a package on package structure, the method comprising:
- providing a substrate, wherein the substrate has a first plurality of bumps and a second plurality of bumps, wherein the second plurality of bumps surrounds the first plurality of bumps;
- applying a no-reflow underfill (NUF) layer over the substrate;
- bonding a semiconductor die to the first plurality of bumps on the substrate using heat supplied by the semiconductor die;
- and
- bonding an interposer frame to the second plurality of the bumps on the substrate using heat supplied by the interposer frame, wherein the interposer frame surrounds the semiconductor die, wherein the semiconductor die is disposed in an opening of the interposer frame.
A method of forming a package on package structure, the method comprising:
- providing a substrate, wherein the substrate has a first plurality of bumps and a second plurality of bumps, wherein the second plurality of bumps surrounds the first plurality of bumps;
- applying a no-reflow underfill (NUF) layer over the substrate;
- bonding a semiconductor die to the first plurality of bumps on the substrate using heat supplied by the semiconductor die;
- bonding an interposer frame to the second plurality of the bumps on the substrate using heat supplied by the interposer frame, wherein the interposer frame surrounds the semiconductor die, wherein the semiconductor die is disposed in an opening of the interposer frame;
- positioning a packaged die over the semiconductor die and the interposer frame, wherein the packaged die has a plurality of bumps aligned with a plurality of TSHs of the interposer frame;
- and
- performing a reflow process to allow solder of the second plurality of bumps of the substrate and the solder of the plurality of bumps of the packaged die to fill the plurality of through substrate holes (TSHs).
A semiconductor package, comprising:
- a substrate with a first plurality of bumps and a second plurality of bumps;
- an interposer frame, wherein the interposer frame includes a plurality of through substrate holes (TSHs) and an opening defined therein, wherein a portion of at least one bump of the second plurality of bumps extends into at least one TSH of the plurality of TSHs;
- and
- a semiconductor die bonded to the first plurality of bumps of the substrate and disposed in the opening within the interposer frame, wherein the second plurality of bumps of the substrate are aligned with and bonded to the plurality of TSHs;
- and
- a no-reflow underfill (NUF) layer sandwiched between the semiconductor die, the interposer frame, and the substrate, wherein the NUF layer fills the space between the semiconductor die and the substrate, and wherein NUF layer also fills the space between the interposer frame and the substrate.
Dependencies are inferred from the claim text.